DEPOSITION OF A-SiC:H, A-Si02 AND TETRAHEDRAL-C WITH PROGRAMMABLE IN-SITU ETCHING
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High Aspect Ratio Single Crystalline Silicon Microstructures Fabricated With Multi Layer Substrates - Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference o
This paper reports a new method for making high aspect ratio Single Crystalline Silicon (SCS) microstructures om multi layer substrates using Chemical Mechanical Polishing (CMP), Silicon Fusion Bonding (SFB) and Reactive Ion Etching (NE) techniques. First Si-Si02-PolySi-Si02-Si sandwich wafers were fabricated using CMP and SFB. Then microstructures were fabricated on these sandwich wafers using...
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